Fonon DSS (Display & Semiconductor systems) is a division of Fonon Technology International. Fonon DSS focuses on the semiconductor and flat panel display industry, utilizing the patented Zero Width Laser Cutting TechnologyTM and Fantom Wafer Dicing TechnologyTM. Fonon DSS develops and manufacture state-of-the-art equipment and Technologies for glass scribing, cutting and breaking, wafer dicing, ITO ablation, direct patterning, direct laser component marking, fiber laser material processing solutions, UID, portable laser systems. With the technology Fonon acquires, Fonon Display and Semiconductor Systems (FononDSS), has been able to launch a number of products that make the most of the technology for the semiconductor and flat panel display industry.
Fonon DSS flat panel display equipment is used in helping to create very thin display screens for portable computers, T.V. screens, radio faces, and most LCD technology. Fonon DSS was the first in the world to develop a laser scribing system with simultaneous Laser Scribe and Break capabilities for singulation of Flat Panel Display panels specifically for Generation 6 and 8 Glass panels
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Fonon's Fantom Wafer Dicing TechnologyTM will cover unprecedented explosive growth and demand in semiconductor markets in China, Taiwan, Japan and Korea. This technology has lead to products, such as the BlackStar™, that offer the best in silicon wafer dicing over existing technologies.
Fantom Wafer Dicing TechnologyTM will slice the wafer much cleaner than mechanical saws that may cause wafer damage, and increase the yield per wafer as well as maximum throughput while minimizing the HAZ.
Fonon DSS Systems are applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials.
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